Chama, Christopher C. <br/><br/>
Stress evolution in copper-silver thin films during thermal-cycling/ 
Christopher C. Chama 
 - 414-419p. 
<br/><br/> Appeared in Materials Science and Engineering A532(2012)414-419 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Copper-Silver<br/>Thin Films<br/>Mechanical Characterization<br/>Nanostructured Materials