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Stress evolution in copper-silver thin films during thermal-cycling/ Christopher C. Chama

By: Chama, Christopher C.
Contributor(s): ELSEVIER.
Material type: materialTypeLabelBookDescription: 414-419p.Subject(s): Copper-Silver | Thin Films | Mechanical Characterization | Nanostructured Materials
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Item type Current location Call number Copy number Status Date due Barcode
Government Publications Government Publications Main Library
Special collections 		SOP-CHA 2011 (Browse shelf) 1 Available 33729005386847

Appeared in Materials Science and Engineering A532(2012)414-419

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